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Novel chia (Salvia Hispanica L.) residue-based substrate formulations for oyster mushroom (Pleurotus ostreatus) cultivation

Clara R. Azzam; Monica Mburu; Ahmed M. S. Hussein; Ramadan A. Arafa; Mokhtar S. Rizk; Arafat A. Abdel Latef; Mostafa M. Rady; Emad A. Salem
World Journal of Microbiology and Biotechnology · Vol. 41, Issue 11 · 2025

Abstract

Chia ( Salvia hispanica ) and mushrooms represent valuable natural resources with numerous beneficial attributes as functional food ingredient with potential health benefits that support human health. The utilization of chia residues as a substrate for mushroom cultivation presents an innovative approach to supports health beneficial mushroom production. The aim of this study was, the residual biomass from chia (variety Misr 1), referred to as chia residue (CR), was evaluated as a substrate component for the cultivation of oyster mushroom ( Pleurotus ostreatus ). The CR was combined with rice straw (RS) and corn stalks (CS) through permutation and integration techniques. A total of ten deferent substrate formulations using deferent percentages of CR, RS and CS and supplemented with wheat bran, gypsum powder and calcium carbonate were prepared and evaluated using JUNCAO technology. Evaluation criteria included mushroom yield, quality, and chemical composition. Results indicated that substrates containing 86% RS or a mixture of 64% CR and 22% RS achieved complete mycelial colonization within 23 days. Primordial formation was observed by day 33 in most formulations. Formulations with balanced ratios of RS and CR (64:22 or 22:64) achieved the highest yields and improved nutritional quality, both demonstrating enhanced nutritional profiles and bioactive compound content.

Bibliographic Information

JournalWorld Journal of Microbiology and Biotechnology
PublisherSpringer
Publication Date2025-11-01
Publication Year2025
Volume41
Issue11
Document TypeJournal Article
eISSN1573-0972
DOI10.1007/s11274-025-04645-8

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NARA Access Coverage1985-01-01~Current
Journal Homepagehttps://www.springer.com/journal/11274
Publisher PageOpen Publisher Page
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