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A wood-inspired epoxy-based electronic packaging material with vertically aligned thermally conductive channels for electromagnetic waves absorption and thermal management

Jiawei Luo; Ze Lv; Qianqian Wang; Linping Zhang; Yi Zhong; Hong Xu; Zhiping Mao
Chemical Engineering Journal · Vol. 495 · pp. 153202 · 2024
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Bibliographic Information

JournalChemical Engineering Journal
PublisherElsevier
Publication Date2024-09-01
Publication Year2024
Volume495
Pages153202
Document TypeJournal Article
eISSN1385-8947
DOI10.1016/j.cej.2024.153202
SubjectEnvironmental Science

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NARA Access Coverage1997-01-01~Current
Journal Homepagehttps://www.sciencedirect.com/science/journal/13858947
Publisher PageOpen Publisher Page
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