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Liquid metal particles enabled ultrahigh isotropic thermal conductivity in soft thermal interface materials for biochips packaging

Yoonsu Lee; Sangkeun Oh; Yu-Jin Song; Ji-un Jang; Joo Hyung Lee; Seoyeon Won; Joohwan Yoo; Youngho Eom; Han-Kyun Shin; Huanan Zhang; Qian Zhou; Shi Hyeong Kim; Jung Han Kim; Taehwan Lim
Chemical Engineering Journal · Vol. 541 · pp. 177400 · 2026
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Bibliographic Information

JournalChemical Engineering Journal
PublisherElsevier
Publication Date2026-08-01
Publication Year2026
Volume541
Pages177400
Document TypeJournal Article
eISSN1385-8947
DOI10.1016/j.cej.2026.177400
SubjectEnvironmental Science

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NARA Access Coverage1997-01-01~Current
Journal Homepagehttps://www.sciencedirect.com/science/journal/13858947
Publisher PageOpen Publisher Page
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