Photocurable low-dielectric polyimide via acrylate side-chain engineering for 3D-printed RF applications - Subin Jo; Seyeon Park; Gwajeong Jeong; Bo-Young Kim; Yongchan Jang; Ji-Hun Seo; Seong-Dae Park; Sungjoon Lim; Hyunseung Yang (Chemical Engineering Journal, 2026)