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Architecting optimized thermal conduction pathways in colonnade-structured polydimethylsiloxane-based thermal interface materials by direct ink writing

Kunpeng Ruan; Yuanyuan Tian; Yujia Tian; Mukun Li; Kun Zhou; Junwei Gu
Science Bulletin · Vol. 71, Issue 8 · pp. 2033-2043 · 2026
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Bibliographic Information

JournalScience Bulletin
PublisherElsevier
Publication Date2026-04-01
Publication Year2026
Volume71
Issue8
Pages2033-2043
Document TypeJournal Article
eISSN2095-9273
DOI10.1016/j.scib.2026.03.011
SubjectEarth and Planetary Sciences

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NARA Access Coverage2026-03-01~2026-03-01
Journal Homepagehttps://www.sciencedirect.com/science/journal/20959273
Publisher PageOpen Publisher Page
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