Lignin, a biopolymer formed in the cell walls of plants, is a by‐product of paper manufacturing. In research at IBM, it was incorporated into a resin used in the fabrication of printed wiring boards (PWB) for the microelectronics industry. The resin had physical and electrical properties similar to those of current laminate resins. PWBs fabricated from the lignin‐based resin passed most of the standard physical, electrical, an...