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Photocurable low-dielectric polyimide via acrylate side-chain engineering for 3D-printed RF applications

Subin Jo; Seyeon Park; Gwajeong Jeong; Bo-Young Kim; Yongchan Jang; Ji-Hun Seo; Seong-Dae Park; Sungjoon Lim; Hyunseung Yang
Chemical Engineering Journal · Vol. 545 · pp. 179752 · 2026
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Bibliographic Information

JournalChemical Engineering Journal
PublisherElsevier
Publication Date2026-10-01
Publication Year2026
Volume545
Pages179752
Document TypeJournal Article
eISSN1385-8947
DOI10.1016/j.cej.2026.179752
SubjectEnvironmental Science

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NARA Access Coverage1997-01-01~Current
Journal Homepagehttps://www.sciencedirect.com/science/journal/13858947
Publisher PageOpen Publisher Page
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